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 Theory, Approaches and Applications Semiconductor Device Attachment by Silver Paste Sintering.
Наименование:

Theory, Approaches and Applications Semiconductor Device Attachment by Silver Paste Sintering.

автор zhiye z. издательство Книга по Требованию Организация здравоохранения
Cтраниц 188        мягкая обложка       
Аннотация:With the large external pressure, the micro-scale silver paste can be sintered to form high-quality interconnection layer at 240oC. This book should be helpful for researches and engineers in the power semiconductor assembling and applications. The low- temperature sintering nanoscale technique was successfully demonstrated in the interconnecting SiC device for high-temperature application. Since this book demonstrated a novel sintering technique with superior performance even at high temperature (>800oC), it should be also useful to professionals in high power LED, laser device, and etc. The external pressure, however, makes this technique difficult to implement. Silver interconnection has superior performance than current interconnection materials/techniques, including conductive adhesives and reflowed solders; but high processing temperature prevent its application. Because nanoscale silver particles have lower sintering temperature, several approaches were developed to address sintering challenges of nanoscale silver particles, such as particles aggregation, agglomeration, and non- densification diffusion at low temperature.
Автор: zhiye z.
Издательство: Книга по Требованию
Год:2009
Цена:
2746 руб
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Поиск: Theory, Approaches and Applications Semiconductor Device Attachment by Silver Paste Sintering.
НОВЫЙ ГОД СИМВОЛ 2013 ГОДАУКРАШЕНИЯ
КАРНАВАЛ НА НОВЫЙ ГОД РАСПРОДАЖА
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